Summary

The finely tuned, purified, and classified spherical silica raw material, after undergoing a thorough surface modification process, is uniformly dispersed in a solvent along with specialized additives.

Feature

High purity, excellent sphericity, narrow particle size distribution, and controllable granularity; complete surface treatment with good flowability; monodisperse with no agglomeration, outstanding sedimentation resistance, and excellent storage stability; high filling rate, low loss, low CTE, and exceptional rheological processing properties.

Function

Copper-clad laminate, EMC packaging material, IC packaging substrate.