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Summary
It is manufactured through multiple processes including high-temperature melting, spheroidization, ultrafine classification, and surface treatment of high-purity quartz powder.
Feature
High purity, high sphericity, excellent fluidity, and a high filling rate; good dielectric properties, favorable fluidity, and low thermal expansion coefficient.
Function
High-speed and high-frequency copper-clad laminate, solid state encapsulant, plastic opening agent, electronic ink, powdered coating.
Summary
It is manufactured through multiple processes including high-temperature melting, spheroidization, ultrafine classification, and surface treatment of high-purity quartz powder.
Feature
High purity, high sphericity, excellent fluidity, and a high filling rate; good dielectric properties, favorable fluidity, and low thermal expansion coefficient.
Function
High-speed and high-frequency copper-clad laminate, solid state encapsulant, plastic opening agent, electronic ink, powdered coating.