On October 17, 2024, the 25th China Copper Clad Coating Technology Seminar was successfully held at the Peninsula Hotel in Jiujiang City, Jiangxi Province. The theme of this seminar is "Exploring New Technologies and Sharing New Opportunities". ZTE's Wei Xinqi gave a report titled "Requirements and Challenges of 224G High speed Interconnection for PCB and Copper Clad Panel", analyzing the technical characteristics of 224G high-speed interconnection, the demand for PCB and high-speed boards, the challenges faced by PCB boards, and the current status of PCB technology from four aspects; The new round of technological revolution and industrial transformation is deeply evolving, driving the deep transformation and upgrading of industries. The new generation of information technology represented by AI will empower thousands of industries and become a new engine for the electronic information industry.

With the rapid development of AI and the increasing demand for large-scale integrated circuits, the importance of high-speed copper-clad laminates as a circuit board material with high-frequency characteristics and excellent signal transmission performance is becoming increasingly prominent. As a leading enterprise in high-speed copper-clad laminate raw materials, Jinyi New Materials provides products with better power generation performance, mechanical performance, and heat resistance. It has five advantages in high-speed packing solutions: full coverage, high standards, thick accumulation, reliability, and fast iteration. Jinyi New Materials is providing strong support for the upgrading and transformation of the industry.

The marketing and R&D team of Ginet New Materials participated in the seminar and had full exchanges with the attending experts and business representatives. Looking ahead to the future, Jinyi New Materials will continue to increase research and development investment, constantly innovate, and work together with all sectors of the industry to help high-speed copper-clad laminates and embrace the new future of AI.